LexDanaLexDanabeta
Inventor

Hyo-Chang Ryu

Inventor
Cheonan-si, KR

Overview

3→
Patents
2014–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
10,431,522Thermal interface material layer and package-on-package device including the same20199,899,294'Thermal interface material layer and package-on-package device including the same'20188,829,686'Package-on-package assembly including adhesive containment element'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2019Patents assigned to SAMSUNG ELECTRONICS CO LTD (3)· patent assignee history
2014Based in Asan-si, KR· patent location history
2018Patents assigned to KIM JONGKOOK (1)· patent assignee history
2018Patents assigned to LEE JANGWOO (1)· patent assignee history
2018Patents assigned to NA MIN OK (1)· patent assignee history
2018Patents assigned to PARK JIN WOO (1)· patent assignee history
2018–2019Based in Cheonan-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SAMSUNG ELECTRONICS CO LTD32014–2019
KIM JONGKOOK12018
LEE JANGWOO12018
NA MIN OK12018
PARK JIN WOO12018
Locations
LocationPatentsSpan
Cheonan-si, KR22018–2019
Asan-si, KR12014