Inventor
Ting-Yu Yeh
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
A01NPreservation of bodies of humans or animals or plants or parts thereof6%
A61KPreparations for medical, dental or toiletry purposes6%
C12NMicroorganisms or enzymes6%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
10,867,954Interconnect chips202010,720,401Interconnect chips202010,626,375Disease control of the plant bacterial pathogens causing citrus canker and rice blight202010,515,869Semiconductor package structure having a multi-thermal interface material structure201910,304,800Packaging with substrates connected by conductive bumps20199,899,305'Semiconductor package structure'2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2018–2020Based in Hsinchu, TW· patent location history
2020Patents assigned to AUXERGEN INC (1)· patent assignee history
2020Based in Baltimore, MD, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2018–2020 |
| AUXERGEN INC | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 5 | 2018–2020 |
| Baltimore, Maryland, US | 1 | 2020 |