Inventor
Lakshmipriya Seshan
Inventor
US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing37%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1026%
H01LSemiconductor devices21%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use11%
G11CStatic stores3%
H03MCoding3%
PatentTitleYear
12,591,727Lane repair and lane reversal implementation for die-to-die (D2D) interconnects202612,554,672Link layer-PHY interface adapter202612,499,019Retimers to extend a die-to-die interconnect202512,481,614Standard interfaces for die to die (D2D) interconnect stacks202512,468,597Valid signal for latency sensitive die-to-die (D2D) interconnects202512,405,912Link initialization training and bring up for die-to-die interconnect202512,362,306Clock-gating in die-to-die (D2D) interconnects202512,360,934Parameter exchange for a die-to-die interconnect202512,353,305Compliance and debug testing of a die-to-die interconnect202512,332,826Die-to-die interconnect202512,321,305Sideband interface for die-to-die interconnects202512,316,343PHY-based retry techniques for die-to-die interfaces202512,298,833Performance level control in a data processing apparatus202512,159,840Scalable and interoperable PHYLESS die-to-die IO solution202412,117,960Approximate data bus inversion technique for latency sensitive applications202411,971,841Link layer-PHY interface adapter2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024–2026Patents assigned to INTEL CORP (16)· patent assignee history
2024–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 16 | 2024–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 16 | 2024–2026 |