Inventor
SOON WEI WANG
Inventor
MY
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
Y10TTechnical subjects covered by former us classification4%
H10DInorganic electric semiconductor devices2%
PatentTitleYear
12,444,609Silicon-on-insulator die support structures and related methods202512,424,522Leadless semiconductor packages, leadframes therefor, and methods of making202512,374,554Semiconductor packages with die including cavities and related methods202512,374,555Die sidewall coatings and related methods202512,243,810Semiconductor package with wettable flank and related methods202512,176,272Semiconductor package with wettable flank202412,040,192Die sidewall coatings and related methods202411,908,699Semiconductor packages with die including cavities202411,901,184Backmetal removal methods202411,894,234Semiconductor packages with die support structure for thin die202411,721,654Ultra-thin multichip power devices202311,532,539Semiconductor package with wettable flank202211,508,679Polymer resin and compression mold chip scale package202211,404,276Semiconductor packages with thin die and related methods202211,404,277Die sidewall coatings and related methods202211,361,970Silicon-on-insulator die support structures and related methods202211,348,796Backmetal removal methods202211,342,189Semiconductor packages with die including cavities and related methods2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SEMICONDUCTOR COMPONENTS IND LLC (18)· patent assignee history
2022–2025Based in MY· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEMICONDUCTOR COMPONENTS IND LLC | 18 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 18 | 2022–2025 |