Inventor
Antonio B. Dimaano, Jr.
Inventor
Singapore, SG
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1059%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H01LSemiconductor devices10%
Y10TTechnical subjects covered by former us classification5%
H05KPrinted circuits2%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
10,714,431Semiconductor packages with electromagnetic interference shielding202010,658,277Semiconductor package with a heat spreader and method of manufacturing thereof202010,573,590Multi-layer leadless semiconductor package and method of manufacturing the same20209,564,387'Semiconductor package having routing traces therein'20179,472,532'Leadframe area array packaging technology'20169,023,690'Leadframe area array packaging technology'20158,536,689'Integrated circuit package system with multi-surface die attach pad'20138,513,542'Integrated circuit leaded stacked package system'20138,421,197'Integrated circuit package system with warp-free chip'20138,422,243'Integrated circuit package system employing a support structure with a recess'20138,274,145'Semiconductor package system with patterned mask over thermal relief'20128,232,658'Stackable integrated circuit package system with multiple interconnect interface'20128,178,394'Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof'20128,174,127'Integrated circuit package system employing device stacking'20128,120,187'Integrated circuit package system employing device stacking and method of manufacture thereof'20128,106,500'Stackable integrated circuit package system'20127,986,043'Integrated circuit package on package system'20117,981,702'Integrated circuit package in package system'20117,936,055'Integrated circuit package system with interlock'20117,928,540'Integrated circuit package system'20117,892,894'Method of manufacturing integrated circuit package system with warp-free chip'20117,863,108'Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof'20117,830,020'Integrated circuit package system employing device stacking'20107,777,320'Quad flat pack in quad flat pack integrated circuit package system'20107,741,707'Stackable integrated circuit package system'20107,556,987'Method of fabricating an integrated circuit with etched ring and die paddle'20097,545,032'Integrated circuit package system with stiffener'20097,541,222'Wire sweep resistant semiconductor package and manufacturing method therefor'20097,482,683'Integrated circuit encapsulation system with vent'20097,479,692'Integrated circuit package system with heat sink'20097,456,496'Package design and method of manufacture for chip grid array'20087,385,299'Stackable integrated circuit package system with multiple interconnect interface'20087,141,886'Air pocket resistant semiconductor package'20066,929,981'Package design and method of manufacture for chip grid array'20056,734,039'Semiconductor chip grid array package design and method of manufacture'20046,543,127'Coplanarity inspection at the singulation process'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2020Based in Singapore, SG· patent location history
2006–2013Patents assigned to STATS CHIPPAC LTD (26)· patent assignee history
2012–2013Patents assigned to DIMAANO JR ANTONIO B (9)· patent assignee history
2012–2013Patents assigned to MERILO DIOSCORO A (6)· patent assignee history
2012–2013Patents assigned to CHOW SENG GUAN (4)· patent assignee history
2016–2020Patents assigned to UTAC HEADQUARTERS PTE LTD (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC LTD | 26 | 2006–2013 |
| DIMAANO JR ANTONIO Bself | 9 | 2012–2013 |
| MERILO DIOSCORO A | 6 | 2012–2013 |
| UTAC HEADQUARTERS PTE LTD | 5 | 2016–2020 |
| CHOW SENG GUAN | 4 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 36 | 2003–2020 |