Inventor

Yoshihiro Uozumi

Inventor
Yokohama, JP

Overview

26→
Patents
2001–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 26 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10DInorganic electric semiconductor devices13%
H01LSemiconductor devices10%
H10BElectronic memory devices8%
C23CCoating metallic material6%
C11DDetergent compositions3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
C23FNon-mechanical removal of metallic material from surface2%
C23GCleaning or de-greasing of metallic material by chemical methods other than electrolysis2%
PatentTitleYear
9,929,017'Etching method using hydrogen peroxide solution containing tungsten'20189,553,189'Self-aligned silicide formation on source/drain through contact via'20179,213,242'Substrate processing method and substrate processing apparatus'20159,099,474'Self-aligned silicide formation on source/drain through contact via'20158,946,809'Method for manufacturing semiconductor memory device and semiconductor memory device'20158,912,089'Method for manufacturing a semiconductor device including a stacked body comprising pluralities of first and second metallic conductive layers'20148,513,140'Post-dry etching cleaning liquid composition and process for fabricating semiconductor device'20138,349,718'Self-aligned silicide formation on source/drain through contact via'20138,222,160'Metal containing sacrifice material and method of damascene wiring formation'20128,211,800'Ru cap metal post cleaning method and cleaning chemical'20128,168,528'Restoration method using metal for better CD controllability and Cu filing'20127,884,027'Method of manufacturing semiconductor device'20117,850,818'Method of manufacturing semiconductor device and cleaning apparatus'20107,776,754'Semiconductor device manufacturing method and chemical fluid used for manufacturing semiconductor device'20107,635,601'Method of manufacturing semiconductor device and cleaning apparatus'20097,405,133'Semiconductor device and method for manufacturing the same'20087,345,352'Insulating tube, semiconductor device employing the tube, and method of manufacturing the same'20087,282,437'Insulating tube, semiconductor device employing the tube, and method of manufacturing the same'20077,183,203'Method of plating a metal or metal compound on a semiconductor substrate that includes using the same main component in both plating and etching solutions'20077,022,580'Semiconductor device and method for manufacturing the same'20066,995,472'Insulating tube'20066,818,556'Method of plating a metal or metal compound on a semiconductor substrate that includes using the same main component in both plating and etching solutions'20046,492,271'Semiconductor device and method of manufacturing the same'20026,475,909'Method of fabricating metal wiring on a semiconductor substrate using ammonia-containing plating and etching solutions'20026,459,111'Semiconductor device and method for manufacturing the same'20026,261,953'Method of forming a copper oxide film to etch a copper surface evenly'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2017Patents assigned to TOSHIBA KK (25)· patent assignee history
2001–2013Based in Yokohama, JP· patent location history
2012–2015Patents assigned to UOZUMI YOSHIHIRO (6)· patent assignee history
2012–2017Based in Somers, NY, US· patent location history
2013Patents assigned to ASADA KAZUMI (1)· patent assignee history
2013Patents assigned to HAGINO YUKINO (1)· patent assignee history
2014–2018Based in Aichi, JP· patent location history
2015Patents assigned to HIRABAYASHI HIDEAKI (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK252001–2017
UOZUMI YOSHIHIROself62012–2015
ASADA KAZUMI12013
HAGINO YUKINO12013
HIRABAYASHI HIDEAKI12015
Locations
LocationPatentsSpan
Yokohama, JP162001–2013
Somers, New York, US62012–2017
Aichi, JP42014–2018