LexDanaLexDanabeta
Inventor

Jan-Her Horng

Inventor
Kaohsiung, TW

Overview

3→
Patents
1999–2006
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h10100%
PatentTitleYear
7,105,379'Implementation of protection layer for bond pad protection'20066,258,706'Method for fabricating a stress buffered bond pad'20015,942,800'Stress buffered bond pad and method of making'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2006Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history
1999–2001Based in Kaohsiung, TW· patent location history
2006Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG31999–2006
Locations
LocationPatentsSpan
Kaohsiung, TW21999–2001
Hsinchu, TW12006