Inventor
Mineo Shimotsusa
Inventor
Machida, JP
Overview
Patents· 84 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation32%
H01LSemiconductor devices28%
H04NPictorial communication, e.g. television11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
H10DInorganic electric semiconductor devices7%
B41JTypewriters4%
H10KOrganic electric solid-state devices3%
H10BElectronic memory devices2%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h102%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2%
PatentTitleYear
11,108,982Solid-state imaging device and manufacturing method therefor202111,102,440Solid-state imaging device and imaging system202110,998,368Semiconductor apparatus202110,937,822Photoelectric conversion device and manufacturing method of the photoelectric conversion device202110,882,314Liquid ejection head, method for producing liquid ejection head, and liquid ejection apparatus202110,852,184Photoelectric conversion apparatus and image pickup system having photoelectric conversion apparatus202010,766,255Element substrate202010,763,291Solid-state image sensor and method of manufacturing the same202010,615,204Solid-state image pickup device and method of making the same202010,573,680Solid-state image pickup device202010,546,891Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device202010,497,734Solid-state imaging apparatus201910,462,405Solid-state imaging device and manufacturing method therefor201910,325,948Solid-state image sensor and method of manufacturing the same201910,304,899Solid-state imaging device and imaging system201910,263,029Photoelectric conversion device and manufacturing method of the photoelectric conversion device201910,229,948Semiconductor apparatus201910,217,786Solid-state image pickup device201910,158,817Solid-state imaging apparatus and imaging system201810,038,023Solid-state image sensor and method of manufacturing the same201810,026,774Method of manufacturing solid-state image sensor and solid-state image sensor20189,929,202'Solid-state image pickup device'20189,906,743'Solid-state imaging apparatus and imaging system having a light shielding portion'20189,899,449'Solid-state imaging device and imaging system'20189,897,482'Photoelectric conversion apparatus and image pickup system having photoelectric conversion apparatus'20189,887,227'Solid-state image sensor and method of manufacturing the same'20189,881,957'Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device'20189,865,637'Photoelectric conversion device and manufacturing method of the photoelectric conversion device'20189,787,931'Solid-state imaging device and manufacturing method therefor'20179,716,126'Method of manufacturing solid-state image sensor'20179,704,905'Solid-state image sensor and method of manufacturing the same'20179,640,581'Solid-state image pickup device'20179,608,033'Solid-state image sensor, method of manufacturing the same, and camera'20179,577,003'Method of forming an image pickup device having two waveguides and a light-shielding member'20179,508,775'Solid-state imaging apparatus and manufacturing method of solid-state imaging apparatus'20169,450,012'Solid-state imaging device and manufacturing method therefor'20169,419,030'Solid-state image pickup device'20169,397,131'Solid-state imaging apparatus having electrical connection portions with lengths extending in first direction longer than in second direction'20169,391,112'Semiconductor apparatus'20169,373,658'Solid-state image pickup apparatus, image pickup system including solid-state image pickup apparatus, and method for manufacturing solid-state image pickup apparatus'20169,368,544'Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device'20169,344,653'Solid-state imaging apparatus and imaging system'20169,324,744'Solid-state image sensor having a trench and method of manufacturing the same'20169,312,289'Photoelectric conversion apparatus, manufacturing method thereof, and image pickup system'20169,263,487'Photoelectric conversion apparatus'20169,252,169'Solid-state imaging device and imaging system'20169,231,019'Solid-state image sensor and method of manufacturing the same'20169,209,220'Solid-state imaging apparatus and manufacturing method of solid-state imaging apparatus'20159,196,643'Solid-state imaging device having photoelectric conversion units on a first substrate and a plurality of circuits on a second substrate'20159,166,090'Solid-state image pickup device'20159,157,796'Photoelectric conversion apparatus and image pickup system having photoelectric conversion apparatus with substrate including first and second circuits having first and second drive frequencies'20159,147,709'Solid-state image sensor and camera'20159,094,624'Solid-state imaging apparatus and camera'20159,082,820'Manufacturing method of semiconductor apparatus'20159,029,967'Solid-state image pickup device having waveguides in light-receiving and light-shielding areas'20159,029,241'Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device'20159,000,343'Solid-state imaging apparatus'20158,987,852'Solid-state image pickup apparatus, image pickup system including solid-state image pickup apparatus, and method for manufacturing solid-state image pickup apparatus'20158,953,076'Photoelectric conversion device and camera having a photodiode cathode formed by an n-type buried layer'20158,947,566'Solid-state imaging apparatus and manufacturing method of solid-state imaging apparatus'20158,928,041'Solid-state imaging device and manufacturing method therefor'20158,890,331'Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device'20148,878,115'Photoelectric conversion element, and photoelectric conversion apparatus and imaging system having a light guide'20148,817,144'Photoelectric conversion apparatus'20148,779,544'Photoelectric conversion apparatus and imaging system having revision with multiple impurity densities'20148,698,208'Photoelectric conversion device'20148,670,059'Photoelectric conversion device having an n-type buried layer, and camera'20148,482,646'Image sensing device and camera'20138,274,122'Photoelectric conversion device, imaging system, photoelectric conversion device designing method, and photoelectric conversion device manufacturing method'20128,163,588'Manufacturing method of a photoelectric conversion device'20127,935,557'Manufacturing method of a photoelectric conversion device'20117,592,578'Photoelectric-conversion apparatus and image-pickup system'20097,411,170'Photoelectric-conversion apparatus and image-pickup system'20087,122,859'Semiconductor device with switching element and corresponding driving circuit formed on a common semiconductor substrate, and liquid emitting apparatus that includes the semiconductor device'20067,056,798'Semiconductor device, method for manufacturing the same, and liquid jet apparatus'20066,962,405'Substrate for ink jet recording head, ink jet recording head and ink jet recording apparatus using ink jet recording head'20056,867,457'Semiconductor device and liquid jetting device using the same'20056,825,543'Semiconductor device, method for manufacturing the same, and liquid jet apparatus'20046,822,289'Semiconductor device and liquid jet apparatus using the same'20046,800,902'Semiconductor device, method of manufacturing the same and liquid jet apparatus'20045,963,812'Manufacturing method of a semiconductor apparatus having an electron donative surface in a side wall portion'19995,580,808'Method of manufacturing a ROM device having contact holes treated with hydrogen atoms and energy beam'19965,569,614'Method of forming metal pattern including a schottky diode'19965,527,730'Method of forming a capacitor having contact hole treated with hydrogen atoms and energy beam'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2021Patents assigned to CANON KK (83)· patent assignee history
1996–1999Based in Atsugi, JP· patent location history
2004–2006Based in Tokyo, JP· patent location history
2008–2021Based in Machida, JP· patent location history
2012–2016Patents assigned to SHIMOTSUSA MINEO (16)· patent assignee history
2013–2015Patents assigned to ICHIKAWA TAKESHI (6)· patent assignee history
2014–2015Patents assigned to KATO TARO (3)· patent assignee history
2015–2016Patents assigned to KOBAYASHI MASAHIRO (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CANON KK | 83 | 1996–2021 |
| SHIMOTSUSA MINEOself | 16 | 2012–2016 |
| ICHIKAWA TAKESHI | 6 | 2013–2015 |
| KATO TARO | 3 | 2014–2015 |
| KOBAYASHI MASAHIRO | 3 | 2015–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Machida, JP | 73 | 2008–2021 |
| Tokyo, JP | 7 | 2004–2006 |
| Atsugi, JP | 4 | 1996–1999 |