Inventor
UN-BYOUNG KANG
Inventor
KR
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices44%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation1%
PatentTitleYear
12,512,427Semiconductor device including lower pads having different widths and semiconductor package including the same202512,469,810Semiconductor package202512,431,474Semiconductor package202512,355,005Semiconductor package and method of fabricating the same202512,300,665Semiconductor package202512,218,039Semiconductor package202512,211,806Semiconductor package with dummy pattern not electrically connected to circuit pattern202512,165,991Semiconductor package202412,119,306Semiconductor package202412,113,050Semiconductor package with increased thermal radiation efficiency202412,094,847Semiconductor package and method of manufacturing the same202412,074,141Semiconductor package202412,040,294Semiconductor devices and semiconductor packages including the same202412,014,977Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure202411,955,449Stacked semiconductor package202411,948,903Semiconductor package202411,935,873Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips202411,735,494Semiconductor package202311,694,996Semiconductor package including a pad contacting a via202311,694,978Semiconductor devices and semiconductor packages including the same202311,688,679Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure202311,682,630Semiconductor package202311,676,887Semiconductor package202311,658,131Semiconductor package with dummy pattern not electrically connected to circuit pattern202311,621,250Semiconductor packages202311,616,039Semiconductor package202311,594,499Semiconductor package202311,508,685Stacked semiconductor package202211,488,910Semiconductor package having redistribution layer202211,482,554Semiconductor package and method of fabricating the same202211,315,802Method for manufacturing semiconductor package having redistribution layer202211,302,660Semiconductor devices and semiconductor packages including the same202211,282,792Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads202211,227,855Semiconductor package202211,222,873Semiconductor packages including stacked substrates and penetration electrodes2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to SAMSUNG ELECTRONICS CO LTD (35)· patent assignee history
2022–2025Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 35 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 35 | 2022–2025 |