Inventor

William R. Crumly

Inventor
Anaheim, CA, US

Overview

31→
Patents
1991–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 31 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits27%
Y10TTechnical subjects covered by former us classification20%
G01RMeasuring electric variables14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
H01RElectrically-conductive connections10%
Y02PClimate change mitigation technologies in the production or processing of goods4%
G06KGraphical data reading3%
G06VImage or video recognition or understanding3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
B23KSoldering or unsoldering1%
PatentTitleYear
10,803,289Fingerprint reader202010,346,672Fingerprint reader20196,547,944'Commercial plating of nanolaminates'20036,303,988'Wafer scale burn-in socket'20016,166,333'Bumps with plural under-bump dielectric layers'20006,109,369'Chip scale package'20006,007,669'Layer to layer interconnect'19995,946,555'Wafer level decal for minimal packaging of chips'19995,924,193'Method of making mandrels and circuits therefrom'19995,896,271'Integrated circuit with a chip on dot and a heat sink'19995,762,845'Method of making circuit with conductive and non-conductive raised features'19985,600,256'Cast elastomer/membrane test probe assembly'19975,563,521'Membrane connector with stretch induced micro scrub'19965,412,866'Method of making a cast elastomer/membrane test probe assembly'19955,412,539'Multichip module with a mandrel-produced interconnecting decal'19955,395,253'Membrane connector with stretch induced micro scrub'19955,364,277'Three-dimensional electroformed circuitry'19945,354,205'Electrical connections with shaped contacts'19945,340,296'Resilient interconnection bridge'19945,339,027'Rigid-flex circuits with raised features as IC test probes'19945,307,561'Method for making 3-D electrical circuitry'19945,264,787'Rigid-flex circuits with raised features as IC test probes'19935,261,158'Method of forming a resilient interconnection bridge'19935,245,750'Method of connecting a spaced IC chip to a conductor and the article thereby obtained'19935,245,135'Stackable high density interconnection mechanism (SHIM)'19935,233,157'Laser pattern ablation of fine line circuitry masters'19935,207,887'Semi-additive circuitry with raised features using formed mandrels'19935,197,184'Method of forming three-dimensional circuitry'19935,180,311'Resilient interconnection bridge'19935,069,628'Flexible electrical cable connector with double sided dots'19915,009,605'Flat electrical connector assembly with precisely aligned soldering traces'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–1997Patents assigned to HUGHES AIRCRAFT CO (20)· patent assignee history
1991–2020Based in Anaheim, CA, US· patent location history
1998–2001Patents assigned to PACKARD HUGHES INTERCONNECT CO (7)· patent assignee history
2000–2003Patents assigned to DELPHI TECH INC (2)· patent assignee history
2019–2020Patents assigned to CRUMLY WILLIAM R (2)· patent assignee history
2019–2020Patents assigned to JENSEN ERIC DEAN (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HUGHES AIRCRAFT CO201991–1997
PACKARD HUGHES INTERCONNECT CO71998–2001
CRUMLY WILLIAM Rself22019–2020
DELPHI TECH INC22000–2003
JENSEN ERIC DEAN22019–2020
Locations
LocationPatentsSpan
Anaheim, California, US311991–2020