Inventor

Atsushi Miki

Inventor

Ibaraki, JP

Overview

1985–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 52 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits17%

Y10TTechnical subjects covered by former us classification14%

C25DProcesses for the electrolytic or electrophoretic production of coatings12%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%

C22CAlloys4%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%

G06VImage or video recognition or understanding3%

H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy3%

PatentTitleYear

10,992,378Information processing apparatus and optical fiber inspection method2021 10,925,170Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device2021 10,925,171Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic device2021 10,820,414Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device2020 10,791,631Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device2020 10,771,150Parallel processing apparatus and replacing method of failing optical transmission line2020 10,664,339Information processing apparatus, information processing system, and information processing apparatus control method2020 10,602,620Laminate for printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device2020 10,581,555Information processing device and burst error reproducing method2020 10,529,992Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil2020 10,472,728Copper foil for printed circuit2019 10,476,391Voltage converting device2019 10,464,291Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board2019 10,383,222Surface-treated copper foil2019 10,194,534Printed wiring board, electronic device, catheter, and metallic material2019 D0837685Eyelet2019 10,153,846Optical communication module, parallel processing apparatus, and adjusting method2018 10,110,304Communication device and inspection method2018 9,730,332'Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminate'2017 9,724,896'Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board'2017 9,580,829'Copper foil for printed circuit'2017 9,504,149'Surface treated copper foil and laminate using the same'2016 9,232,650'Surface treated copper foil and laminate using the same'2016 9,060,431'Liquid crystal polymer copper-clad laminate and copper foil used for said laminate'2015 9,049,795'Rolled copper or copper-alloy foil provided with roughened surface'2015 8,449,987'Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil'2013 8,395,673'Shooting device and method with function for guiding an object to be shot'2013 8,252,166'Method of roughening rolled copper or copper alloy foil'2012 7,522,824'Photographing apparatus photographing method and computer program'2009 7,415,202'Image taking device, method for controlling light sources and computer program'2008 7,406,198'Image capture apparatus'2008 7,340,159'Image taking device and personal identification system'2008 6,805,494'Optical module and optical device'2004 6,400,011'Semiconductor laser module'2002 6,094,515'Optical module'2000 5,787,240'Printer control apparatus converting video data from an external host to video data for a printer'1998 5,436,924'Semiconductor laser device'1995 5,401,099'Method of measuring junction temperature'1995 5,348,214'Method of mounting semiconductor elements'1994 5,302,854'Packaging structure of a semiconductor device'1994 5,298,460'Substrate for packaging a semiconductor device'1994 5,262,355'Method for packaging a semiconductor device'1993 5,244,142'Method of mounting semiconductor elements'1993 5,214,308'Substrate for packaging a semiconductor device'1993 5,212,880'Apparatus for packaging a semiconductor device'1993 5,196,726'Substrate for packaging a semiconductor device having particular terminal and bump structure'1993 5,165,791'Method and apparatus for measuring temperature based on infrared light'1992 5,153,892'High-pressure gas laser apparatus and method of laser processing'1992 5,092,033'Method for packaging semiconductor device'1992 4,808,492'Fuel cell using liquid electrolyte'1989 4,571,570'Winding for static induction apparatus'1986 4,554,523'Winding for static induction apparatus'1985

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1985–1992Patents assigned to HITACHI LTD (4)· patent assignee history

1985–2017Based in Hitachi, JP· patent location history

1992–2019Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (16)· patent assignee history

1992–2021Based in Yokohama, JP· patent location history

1998–2021Patents assigned to FUJITSU LTD (12)· patent assignee history

2008–2013Based in Kato, JP· patent location history

2012–2021Patents assigned to JX NIPPON MINING & METALS CORP (19)· patent assignee history

2012–2017Patents assigned to MIKI ATSUSHI (6)· patent assignee history

2012–2021Based in Ibaraki, JP· patent location history

2018–2020Based in Kawasaki, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
JX NIPPON MINING & METALS CORP	19	2012–2021
SUMITOMO ELECTRIC INDUSTRIES	16	1992–2019
FUJITSU LTD	12	1998–2021
MIKI ATSUSHIself	6	2012–2017
HITACHI LTD	4	1985–1992

Locations

Location	Patents	Span
Ibaraki, JP	15	2012–2021
Yokohama, JP	13	1992–2021
Hitachi, JP	5	1985–2017
Kato, JP	5	2008–2013
Kawasaki, JP	4	2018–2020