Inventor
Ryota Horiike
Inventor
Toyama, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material33%
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
PatentTitleYear
10,497,561Method for manufacturing semiconductor device, substrate-processing apparatus, and recording medium201910,229,829Method for manufacturing semiconductor device, substrate-processing apparatus, and recording medium201910,199,219Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium201910,176,988Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium201910,163,625Method for manufacturing semiconductor device, substrate-processing apparatus, and recording medium201810,121,654Method for manufacturing semiconductor device, substrate-processing apparatus, and recording medium201810,096,463Method of manufacturing semiconductor device, substrate processing apparatus comprising exhaust port and multiple nozzles, and recording medium2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2019Patents assigned to HITACHI INT ELECTRIC INC (5)· patent assignee history
2018–2019Based in Toyama, JP· patent location history
2019Patents assigned to KOKUSAI ELECTRIC CORP (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI INT ELECTRIC INC | 5 | 2018–2019 |
| KOKUSAI ELECTRIC CORP | 3 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyama, JP | 7 | 2018–2019 |