Inventor
Hirokazu Yazaki
Inventor
Nagaokakyo, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices15%
H05KPrinted circuits15%
G06KGraphical data reading10%
H01GCapacitors10%
H01QAntennas, i.e. radio aerials10%
H03HImpedance networks, e.g. resonant circuits10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
C21DModifying the physical structure of ferrous metals5%
H01FMagnets5%
PatentTitleYear
10,970,610RFIC module and RFID tag202110,964,645Electronic component with thin-film shield layer202110,950,381Surface-mounted LC device202110,930,435Multilayer element and LC filter202110,891,529Wireless communication device20214,931,108'Method of heat treatment of rolled steel material using foams impregnated with water soluble polymers'1990Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1990Patents assigned to NIPPON STEEL CORP (1)· patent assignee history
1990Based in Muroran, JP· patent location history
2021Patents assigned to MURATA MANUFACTURING CO (5)· patent assignee history
2021Based in Nagaokakyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MURATA MANUFACTURING CO | 5 | 2021 |
| NIPPON STEEL CORP | 1 | 1990 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagaokakyo, JP | 5 | 2021 |
| Muroran, JP | 1 | 1990 |