Inventor

YOSHIHIDE KIHARA

Inventor

JP

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 40 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%

H01JElectric discharge tubes or discharge lamps27%

H01LSemiconductor devices27%

C23CCoating metallic material7%

H05HPlasma technique5%

C09KMaterials for miscellaneous applications, not provided for elsewhere2%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%

B08BCleaning in general1%

PatentTitleYear

12,560,863Etching method and plasma processing system2026 12,537,171Substrate processing method and substrate processing apparatus2026 12,532,681Etching method and plasma processing system2026 12,512,325Etching method and etching apparatus2025 12,476,115Method for processing workpiece2025 12,412,749Etching method and plasma processing system2025 12,400,835Plasma processing method and plasma processing system2025 12,400,863Method for etching for semiconductor fabrication2025 12,387,941Etching method and plasma processing apparatus2025 12,387,936Plasma processing method and plasma processing system2025 12,368,027Substrate processing method and substrate processing apparatus2025 12,334,343Substrate processing method and substrate processing system2025 12,308,212In-situ adsorbate formation for plasma etch process2025 12,198,938Etching method2025 12,142,484Etching method2024 12,071,687Plasma processing method and plasma processing apparatus2024 11,961,746Substrate processing method and substrate processing apparatus2024 11,955,337Substrate processing method and substrate processing system2024 11,823,903Method for processing workpiece2023 11,798,793Substrate processing method, component processing method, and substrate processing apparatus2023 11,728,166Substrate processing method and substrate processing apparatus2023 11,658,036Apparatus for processing substrate2023 11,637,003Method for etching film and plasma processing apparatus2023 11,615,964Etching method2023 11,600,501Etching method and plasma processing apparatus2023 11,557,485Plasma processing method and plasma processing apparatus2023 11,551,937Etching method2023 11,495,469Method for processing substrates2022 11,495,468Etching method and etching apparatus2022 11,459,655Plasma processing method and plasma processing apparatus2022 11,456,180Etching method2022 11,450,537Substrate processing method and substrate processing apparatus2022 11,417,535Etching method and plasma processing apparatus2022 11,380,551Method of processing target object2022 11,380,555Etching method and etching apparatus2022 11,367,610Film forming and process container cleaning method2022 11,270,889Etching method and etching apparatus2022 11,264,236Substrate processing method2022 11,244,828Method for processing workpiece2022 11,139,175Method of processing target object2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TOKYO ELECTRON LTD (40)· patent assignee history

2021–2026Based in JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TOKYO ELECTRON LTD	40	2021–2026

Locations

Location	Patents	Span
JP	40	2021–2026