Inventor
Lewis M. Eyman
Inventor
Austin, TX, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1075%
B24BMachines, devices, or processes for grinding or polishing25%
PatentTitleYear
6,639,800'Heat sink subassembly'20036,504,243'Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methods'20036,477,047'Temperature sensor mounting for accurate measurement and durability'20025,562,530'Pulsed-force chemical mechanical polishing'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996Patents assigned to SEMATECH INC (1)· patent assignee history
1996Based in San Antonio, TX, US· patent location history
2002–2003Patents assigned to ADVANCED MICRO DEVICES INC (3)· patent assignee history
2002–2003Based in Austin, TX, US· patent location history
2003Based in Pflugerville, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED MICRO DEVICES INC | 3 | 2002–2003 |
| SEMATECH INC | 1 | 1996 |
Locations
| Location | Patents | Span |
|---|---|---|
| Austin, Texas, US | 2 | 2002–2003 |
| Pflugerville, Texas, US | 1 | 2003 |
| San Antonio, Texas, US | 1 | 1996 |