Inventor
ENG HUN OOI
Inventor
MY
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing40%
H04LTransmission of digital information, e.g. telegraphic communication30%
H04BTransmission20%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use10%
PatentTitleYear
12,455,850Root complex integrated endpoint emulation of a discreet PCIE endpoint202511,979,177Time encoded data communication protocol, apparatus and method for generating and receiving a data signal202411,947,995End-to-end data protection for far memory data transfer from host to media202411,704,275Dynamic presentation of interconnect protocol capability structures202311,387,852Time encoded data communication protocol, apparatus and method for generating and receiving a data signal202211,307,638Securely providing multiple wake-up time options for PCI Express2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to INTEL CORP (5)· patent assignee history
2022–2025Based in MY· patent location history
2025Patents assigned to SK HYNIX NAND PRODUCT SOLUTIONS CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 5 | 2022–2024 |
| SK HYNIX NAND PRODUCT SOLUTIONS CORP | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| MY | 6 | 2022–2025 |