Inventor
Kun-Lin Wu
Inventor
Taichung, TW
Overview
Patents· 39 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
B24BMachines, devices, or processes for grinding or polishing11%
G06FElectric digital data processing6%
H10DInorganic electric semiconductor devices5%
A01HNew plants or non-transgenic processes for obtaining them3%
C07KPeptides3%
C12NMicroorganisms or enzymes3%
C12QMeasuring or testing processes involving enzymes, nucleic acids or microorganisms3%
H01RElectrically-conductive connections3%
PatentTitleYear
11,119,786Automated multidimensional elasticity for streaming application runtimes202111,027,260Low pressure nanowire membrane for catalytic reactions and methods of making and using the same202111,020,711Nanoscale membrane for removing trace organic contaminants in a fluid and methods of making and using the same202110,821,579Screw driving device for use with an impact driver202010,741,941Plug connector assembly having an insulative member202010,485,196Rice plants with altered seed phenotype and quality201910,261,927DMA controller with trigger sequence generator201910,209,822Touch sensor and method for determining touch position by grouping electrodes20199,774,113'Grounding plate having an arcuate wall with a soldering notch'20179,688,984'SPL16 compositions and methods to increase agronomic performance of plants'20178,904,333'Mixed signal IP core prototyping system'20148,389,410'Chemical mechanical polishing method'20137,947,603'Chemical-mechanical polishing method'20117,335,598'Chemical-mechanical polishing method'20086,913,993'Chemical-mechanical polishing method'20056,492,240'Method for forming improved high resistance resistor by treating the surface of polysilicon layer'20026,399,503'Method of preventing dishing phenomenon atop a dual damascene structure'20026,333,261'Method for preventing aluminum intrusions'20016,293,850'Chemical-mechanical polish machines and fabrication process using the same'20016,241,582'Chemical mechanical polish machines and fabrication process using the same'20016,234,876'Chemical-mechanical polish machines and fabrication process using the same'20016,225,204'Method for preventing poisoned vias and trenches'20016,197,650'Method for forming capacitor'20016,190,995'Method of fabricating shallow trench isolation structure'20016,183,350'Chemical-mechanical polish machines and fabrication process using the same'20016,180,467'Method of fabricating shallow trench isolation'20016,150,259'Method for forming a metal plug'20006,140,232'Method for reducing silicide resistance'20006,119,294'Cleaning system with automatically controlled brush pressure'20006,120,366'Chemical-mechanical polishing pad'20006,077,784'Chemical-mechanical polishing method'20006,071,806'Method for preventing poisoned vias and trenches'20006,062,963'Retainer ring design for polishing head of chemical-mechanical polishing machine'20006,057,248'Method of removing residual contaminants in an alignment mark after a CMP process'20006,030,892'Method of preventing overpolishing in a chemical-mechanical polishing operation'20006,013,559'Method of forming trench isolation'20006,013,581'Method for preventing poisoned vias and trenches'20005,883,004'Method of planarization using interlayer dielectric'19995,876,508'Method of cleaning slurry remnants after the completion of a chemical-mechanical polish process'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2013Patents assigned to UNITED MICROELECTRONICS CORP (28)· patent assignee history
1999–2013Based in Taichung, TW· patent location history
1999–2000Based in Tai Chung, TW· patent location history
2014Patents assigned to BAI HAIFENG (1)· patent assignee history
2014–2019Based in Suzhou, CN· patent location history
2017–2020Patents assigned to FOXCONN INTERCONNECT TECHNOLOGY LTD (2)· patent assignee history
2017–2020Based in New Taipei, TW· patent location history
2019Patents assigned to NXP USA INC (2)· patent assignee history
2021Patents assigned to UCHICAGO ARGONNE LLC (2)· patent assignee history
2021Based in Naperville, IL, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 28 | 1999–2013 |
| FOXCONN INTERCONNECT TECHNOLOGY LTD | 2 | 2017–2020 |
| NXP USA INC | 2 | 2019 |
| UCHICAGO ARGONNE LLC | 2 | 2021 |
| BAI HAIFENG | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 21 | 1999–2013 |
| Suzhou, CN | 3 | 2014–2019 |
| Tai Chung, TW | 3 | 1999–2000 |
| Naperville, Illinois, US | 2 | 2021 |
| New Taipei, TW | 2 | 2017–2020 |