Inventor
Michael A. Lamson
Inventor
Westminster, TX, US
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1057%
Y10TTechnical subjects covered by former us classification17%
G01RMeasuring electric variables10%
G06FElectric digital data processing5%
H05KPrinted circuits5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
9,030,216'Coaxial four-point probe for low resistance measurements'20158,174,276'Coaxial four-point probe for low resistance measurements'20127,795,072'Structure and method of high performance two layer ball grid array substrate'20107,265,443'Wire bonded semiconductor device having low inductance and noise'20077,195,954'Low capacitance coupling wire bonded semiconductor device'20077,132,845'FA tool using conductor model'20067,132,740'Semiconductor package with conductor impedance selected during assembly'20066,995,037'Structure and method of high performance two layer ball grid array substrate'20066,822,340'Low capacitance coupling wire bonded semiconductor device'20046,820,046'System for electrically modeling an electronic structure and method of operation'20046,794,743'Structure and method of high performance two layer ball grid array substrate'20046,563,208'Semiconductor package with conductor impedance selected during assembly'20036,518,663'Constant impedance routing for high performance integrated circuit packaging'20036,424,027'Low pass filter integral with semiconductor package'20026,323,116'Differential pair geometry for integrated circuit chip packages'20016,084,777'Ball grid array package'20006,064,576'Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board'20006,054,758'Differential pair geometry for integrated circuit chip packages'20006,030,859'Method of making a packaged semiconductor device and a lead-frame therefor'20005,994,169'Lead frame for integrated circuits and process of packaging'19995,840,599'Process of packaging an integrated circuit with a conductive material between a lead frame and the face of the circuit'19985,648,299'Packaged semiconductor device and a leadframe therefor'19975,585,665'Packaged semiconductor device and a leadframe therefor'19965,442,233'Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation'19955,432,127'Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads'19955,334,802'Method and configuration for reducing electrical noise in integrated circuit devices'19945,233,220'Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer'19935,160,893'Method of measuring semiconductor lead inductance by changing the dielectric constant surrounding the lead'19925,083,187'Integrated circuit device having bumped power supply buses over active surface areas and method of manufacture thereof'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2015Patents assigned to TEXAS INSTRUMENTS INC (29)· patent assignee history
1992–2000Based in Van Alstyne, TX, US· patent location history
1993–2010Based in Westminster, TX, US· patent location history
1995–2000Patents assigned to HITACHI LTD (4)· patent assignee history
2002–2015Based in Anna, TX, US· patent location history
2012–2015Patents assigned to DUNNE RAJIV (2)· patent assignee history
2012–2015Patents assigned to GURRUM SIVA PRAKASH (2)· patent assignee history
2012–2015Patents assigned to LAMSON MICHAEL ANTHONY (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 29 | 1992–2015 |
| HITACHI LTD | 4 | 1995–2000 |
| DUNNE RAJIV | 2 | 2012–2015 |
| GURRUM SIVA PRAKASH | 2 | 2012–2015 |
| LAMSON MICHAEL ANTHONYself | 2 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Westminster, Texas, US | 15 | 1993–2010 |
| Van Alstyne, Texas, US | 8 | 1992–2000 |
| Anna, Texas, US | 6 | 2002–2015 |