Inventor
Kai TU
Inventor
CN
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Fprimary
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds17%
C07CAcyclic or carbocyclic compounds11%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry6%
B29CShaping or joining of plastics6%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts6%
B29LIndexing scheme associated with subclass b29c, relating to particular articles6%
C07DHeterocyclic compounds6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%
C08JWorking-up6%
C09KMaterials for miscellaneous applications, not provided for elsewhere6%
PatentTitleYear
12,549,295Hybrid automatic repeat request (HARQ) buffer management202612,107,228Non-aqueous electrolyte for a lithium ion battery and lithium ion battery202411,958,919"Living" radical polymerization method for vinyl monomer by near-infrared photothermal conversion202411,926,697Fluorine-containing liquid crystal elastomer and preparation method and use thereof202411,365,267Fluorine-containing alternating copolymer macromonomer and synthesis method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to UNIV SOOCHOW (3)· patent assignee history
2022–2024Based in CN· patent location history
2024Patents assigned to SHENZHEN CAPCHEM TECHNOLOGY CO LTD (1)· patent assignee history
2026Patents assigned to QUALCOMM INC (1)· patent assignee history
2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNIV SOOCHOW | 3 | 2022–2024 |
| QUALCOMM INC | 1 | 2026 |
| SHENZHEN CAPCHEM TECHNOLOGY CO LTD | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 4 | 2022–2024 |
| US | 1 | 2026 |