Inventor

Suresh K. Chengalva

Inventor

Kokomo, IN, US

Overview

2004–2017

Patent span

Electricity

Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1057%

H05KPrinted circuits13%

Y10TTechnical subjects covered by former us classification10%

B29CShaping or joining of plastics3%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact3%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%

G01CMeasuring distances, levels or bearings3%

G08GTraffic control systems3%

G11BInformation storage based on relative movement between record carrier and transducer3%

PatentTitleYear

9,726,514'Navigation system that displays other-vehicle information'2017 8,797,739'Self circulating heat exchanger'2014 8,471,380'Fluid cooled encapsulated microelectronic package'2013 8,026,597'Fluid cooled encapsulated microelectronic package'2011 7,782,616'Heat-dissipating component having stair-stepped coolant channels'2010 7,485,957'Fluid cooled encapsulated microelectronic package'2009 7,486,515'Fluid circulator for fluid cooled electronic device'2009 7,440,282'Heat sink electronic package having compliant pedestal'2008 7,365,273'Thermal management of surface-mount circuit devices'2008 7,364,684'Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels'2008 7,352,585'Flip chip heat sink package and method'2008 7,334,243'Vane integration into motor hub to enhance CD cooling'2008 7,307,841'Electronic package and method of cooling electronics'2007 7,230,832'Cooled electronic assembly and method for cooling a printed circuit board'2007 7,205,653'Fluid cooled encapsulated microelectronic package'2007 7,180,745'Flip chip heat sink package and method'2007 7,094,975'Circuit board with localized stiffener for enhanced circuit component reliability'2006 6,999,317'Thermally enhanced electronic module with self-aligning heat sink'2006 6,979,900'Integrated circuit package with integral leadframe convector and method therefor'2005 6,807,731'Method for forming an electronic assembly'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2017Patents assigned to DELPHI TECH INC (20)· patent assignee history

2004–2013Based in Kokomo, IN, US· patent location history

2008–2009Based in Carmel, IN, US· patent location history

2010–2017Based in Westfield, IN, US· patent location history

2013–2014Patents assigned to BRANDENBURG SCOTT D (2)· patent assignee history

2013–2014Patents assigned to CHENGALVA SURESH K (2)· patent assignee history

2013Patents assigned to DEGENKOLB THOMAS A (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
DELPHI TECH INC	20	2004–2017
BRANDENBURG SCOTT D	2	2013–2014
CHENGALVA SURESH Kself	2	2013–2014
DEGENKOLB THOMAS A	1	2013

Locations

Location	Patents	Span
Kokomo, IN, US	14	2004–2013
Westfield, IN, US	3	2010–2017
Carmel, IN, US	3	2008–2009