Inventor
Osamu Yamagata
Inventor
Kanagawa, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1065%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H01LSemiconductor devices9%
H10DInorganic electric semiconductor devices6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
H05KPrinted circuits3%
PatentTitleYear
9,196,507'Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing same'20159,147,671'Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing same'20158,901,754'Semiconductor device and manufacturing method thereof'20148,872,350'Semiconductor device and manufacturing method thereof'20148,786,110'Semiconductor device and manufacturing method thereof'20148,263,871'Mount board and semiconductor module'20127,981,722'Semiconductor device and fabrication method thereof'20117,902,672'Semiconductor device and method of manufacturing same'20117,892,887'Semiconductor device and fabrication method thereof'20117,727,803'Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device'20107,510,910'Semiconductor device and production method thereof'20097,462,511'Semiconductor device and the method of producing the same'20087,429,793'Semiconductor device having an electronic circuit disposed therein'20087,220,667'Semiconductor device and method of fabricating the same'20077,214,567'Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film'20077,208,832'Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device'20077,170,175'Semiconductor device and production method thereof'20077,157,796'Semiconductor device and the method of producing the same'20076,960,494'Semiconductor package and method of manufacturing the same'20056,858,892'Semiconductor device'20056,836,012'Semiconductor package and method of manufacturing the same'20045,552,637'Semiconductor device'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996Based in Kawashaki, JP· patent location history
2004–2014Based in Kanagawa, JP· patent location history
2005–2012Patents assigned to SONY CORP (14)· patent assignee history
2012–2015Patents assigned to YAMAGATA OSAMU (6)· patent assignee history
2014–2015Patents assigned to J DEVICES CORP (5)· patent assignee history
2014–2015Patents assigned to INOUE HIROSHI (3)· patent assignee history
2014–2015Patents assigned to KATSUMATA AKIO (3)· patent assignee history
2014Based in Kawasaki, JP· patent location history
2015Based in Yokohama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 14 | 2005–2012 |
| YAMAGATA OSAMUself | 6 | 2012–2015 |
| J DEVICES CORP | 5 | 2014–2015 |
| INOUE HIROSHI | 3 | 2014–2015 |
| KATSUMATA AKIO | 3 | 2014–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 18 | 2004–2014 |
| Yokohama, JP | 2 | 2015 |
| Kawasaki, JP | 1 | 2014 |
| Kawashaki, JP | 1 | 1996 |