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Inventor

Sheng-Wei Hung

Inventor
Taipei, TW

Overview

3→
Patents
2019–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices25%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems25%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers25%
H01LSemiconductor devices13%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
PatentTitleYear
10,640,372Method for fabricating MEMS device integrated with a semiconductor integrated circuit202010,472,232MEMS device integrated with a semiconductor integrated circuit and manufacturing method thereof201910,340,230Semiconductor chip2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2020Patents assigned to UNITED MICROELECTRONICS CORP (3)· patent assignee history
2019–2020Based in Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNITED MICROELECTRONICS CORP32019–2020
Locations
LocationPatentsSpan
Taipei, TW32019–2020