Inventor

Kao-Tsair Tsai

Inventor
Kaohsiung, TW

Overview

12→
Patents
2002–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 12 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices39%
H01LSemiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
H10BElectronic memory devices6%
H10DInorganic electric semiconductor devices6%
H10NElectric solid-state devices not otherwise provided for6%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2020Patents assigned to WINBOND ELECTRONICS CORP (12)· patent assignee history
2002–2007Based in Kaohsiung, TW· patent location history
2004–2011Based in Hsinchu, TW· patent location history
2017–2020Based in Taichung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
WINBOND ELECTRONICS CORP122002–2020
Locations
LocationPatentsSpan
Kaohsiung, TW52002–2007
Hsinchu, TW42004–2011
Taichung, TW32017–2020