Inventor
Bernd Schulz
Inventor
Radebeul, DE
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%
G01NInvestigating or analysing materials by determining their chemical or physical properties7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B01DSeparation5%
B23KSoldering or unsoldering5%
F01NGas-flow silencers or exhaust apparatus for machines or engines in general5%
F16CShafts5%
G01BMeasuring length, thickness or similar linear dimensions5%
Y02ATechnologies for adaptation to climate change5%
PatentTitleYear
10,298,218Method and device for controlling an electrical or electronic switching element20199,300,126'Electrical apparatus for the short-circuit protection of a three-phase load in a three-phase system'20168,652,426'Use of aqueous guanidinium formate solutions for the selective catalytic reduction of nitrogen oxides in exhaust gases of vehicles'20148,531,179'Method and device for the detection of current asymmetries in three-phase circuits'20138,048,390'Method for the selective catalytic reduction of nitrogen oxides in exhaust gases of vehicles'20117,842,442'Method and system for reducing overlay errors within exposure fields by APC control strategies'20107,666,559'Structure and method for determining an overlay accuracy'20107,667,842'Structure and method for simultaneously determining an overlay accuracy and pattern placement error'20107,099,010'Two-dimensional structure for determining an overlay accuracy by means of scatterometry'20066,816,252'Apparatus for determining an overlay error and critical dimensions in a semiconductor structure by means of scatterometry'20046,795,193'Scatterometer including an internal calibration system'20046,767,680'Semiconductor structure and method for determining critical dimensions and overlay error'20046,765,282'Semiconductor structure and method for determining critical dimensions and overlay error'20046,724,096'Die corner alignment structure'20046,622,579'Bearing arrangement for tension forces and bearing head therefor'20036,364,002'Heat storage apparatus'20025,645,354'Aerostatic bearing and method of manufacturing an aerostatic bearing'19975,564,063'Method for manufacture of at least one micronozzle in an aerostatic bearing'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003Based in Unterhaching, DE· patent location history
2004–2010Patents assigned to ADVANCED MICRO DEVICES INC (7)· patent assignee history
2004–2010Based in Radebeul, DE· patent location history
2010Patents assigned to GLOBALFOUNDRIES INC (2)· patent assignee history
2011–2014Patents assigned to ALZCHEM TROSTBERG GMBH (2)· patent assignee history
2011–2014Based in Waldkraiburg, DE· patent location history
2013–2019Patents assigned to PHOENIX CONTACT GMBH & CO (3)· patent assignee history
2013–2016Patents assigned to SCHULZ BERND (3)· patent assignee history
2013–2016Based in Steinheim, DE· patent location history
2019Based in Hoexter, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED MICRO DEVICES INC | 7 | 2004–2010 |
| PHOENIX CONTACT GMBH & CO | 3 | 2013–2019 |
| SCHULZ BERNDself | 3 | 2013–2016 |
| ALZCHEM TROSTBERG GMBH | 2 | 2011–2014 |
| GLOBALFOUNDRIES INC | 2 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Radebeul, DE | 9 | 2004–2010 |
| Steinheim, DE | 2 | 2013–2016 |
| Waldkraiburg, DE | 2 | 2011–2014 |
| Hoexter, DE | 1 | 2019 |
| Unterhaching, DE | 1 | 2003 |