Inventor
Akira Ichida
Inventor
Toyama, JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
B22FWorking metallic powder18%
H05KPrinted circuits14%
C22CAlloys9%
C23CCoating metallic material9%
G21BFusion reactors9%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution9%
Y02PClimate change mitigation technologies in the production or processing of goods5%
PatentTitleYear
6,926,861'Semiconductor package and method for producing heat-radiating substrate for it'20056,693,353'Semiconductor package and method for producing heat-radiating substrate for it'20046,610,375'Plasma facing components of nuclear fusion reactors employing tungsten materials'20036,518,667'Semiconductor package using micro balls and production method thereof'20036,475,429'Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same'20026,271,585'Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same'20016,261,648'Plasma facing components of nuclear fusion reactors employing tungsten materials'20015,493,153'Plastic-packaged semiconductor device having a heat sink matched with a plastic package'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2005Patents assigned to TOKYO TUNGSTEN KK (7)· patent assignee history
1996–2005Based in Toyama, JP· patent location history
2001–2003Patents assigned to JAPAN ATOMIC ENERGY RES INST (2)· patent assignee history
2003Patents assigned to ALLIED MATERIAL CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO TUNGSTEN KK | 7 | 1996–2005 |
| JAPAN ATOMIC ENERGY RES INST | 2 | 2001–2003 |
| ALLIED MATERIAL CORP | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyama, JP | 8 | 1996–2005 |