Inventor

Kazuo Ohkawa

Inventor

Tokyo, JP

Overview

12→

Patents

1987–2005

Patent span

Chemistry

Primary field (CPC C)

Patents· 12 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices19%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds16%

B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering11%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds11%

B29CShaping or joining of plastics5%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts5%

C08LCompositions of macromolecular compounds5%

C09JAdhesives5%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%

PatentTitleYear

6,878,827'Process for producing anhydride of aminothiazole derivative'2005 6,368,769'Aromatic sulfonium compounds, photoacid generators comprising the same, photopolymerizable compositions containing the same, stereolithographic resin compositions, and stereolithographic process'2002 6,319,652'Energy beam curable epoxy resin composition'2001 6,130,025'Stereolithographic resin composition and stereolithographic method'2000 5,985,510'Energy beam curable epoxy resin composition, stereolithographic resin composition and stereolithographic method'1999 5,525,645'Resin composition for optical molding'1996 5,434,196'Resin composition for optical molding'1995 5,360,873'Actinic radiation-reactive pressure-sensitive adhesive composition'1994 5,278,199'Actinic radiation-reactive pressure-sensitive adhesive composition wherein adhesiveness is reduced upon irradiation'1994 5,236,967'Optical molding resin composition comprising polythiol-polyene compounds'1993 5,178,996'Method of making photographic element having epoxy overlayer'1993 4,684,671'Energy beam curable composition'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–2000Patents assigned to ASAHI DENKA KOGYO KK (9)· patent assignee history

1987–2002Based in Tokyo, JP· patent location history

1993Patents assigned to KONISHIROKU PHOTO IND (1)· patent assignee history

2001Patents assigned to ASAHI OPTICAL CO LTD (1)· patent assignee history

2002Patents assigned to ASAHI DENKI KOGYO KABUSHIKI KA (1)· patent assignee history

2005Patents assigned to FUJISAWA PHARMACEUTICAL CO (1)· patent assignee history

2005Based in Osaka, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ASAHI DENKA KOGYO KK	9	1987–2000
ASAHI DENKI KOGYO KABUSHIKI KA	1	2002
ASAHI OPTICAL CO LTD	1	2001
FUJISAWA PHARMACEUTICAL CO	1	2005
KONISHIROKU PHOTO IND	1	1993

Locations

Location	Patents	Span
Tokyo, JP	11	1987–2002
Osaka, JP	1	2005