Inventor
Alexander Huettis
Inventor
US
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering33%
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
11,916,003Varied ball ball-grid-array (BGA) packages2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024Patents assigned to INTEL CORP (1)· patent assignee history
2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 1 | 2024 |