Inventor
Motoki Kawasaki
Inventor
Yokkaichi, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10BElectronic memory devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H10DInorganic electric semiconductor devices8%
PatentTitleYear
10,854,513Cavity-disrupting backside trench fill structures for a three-dimensional memory device and method of making the same202010,804,197Memory die containing stress reducing backside contact via structures and method of making the same20209,754,820'Three-dimensional memory device containing an aluminum oxide etch stop layer for backside contact structure and method of making thereof'20179,437,543'Composite contact via structure containing an upper portion which fills a cavity within a lower portion'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2020Patents assigned to SANDISK TECHNOLOGIES LLC (4)· patent assignee history
2016–2017Patents assigned to SANDISK TECHNOLOGIES INC (2)· patent assignee history
2016–2020Based in Yokkaichi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANDISK TECHNOLOGIES LLC | 4 | 2016–2020 |
| SANDISK TECHNOLOGIES INC | 2 | 2016–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Yokkaichi, JP | 4 | 2016–2020 |