Inventor

HUI-JUNG TSAI

Inventor

TW

Overview

2021–2025

Patent span

Electricity

Primary field (CPC H)

Patents· 48 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices31%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%

H10DInorganic electric semiconductor devices6%

G01NInvestigating or analysing materials by determining their chemical or physical properties2%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%

H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light2%

H10HInorganic light-emitting semiconductor devices having potential barriers2%

G01RMeasuring electric variables1%

PatentTitleYear

12,469,757Package structure including a die having a taper-shaped die connector2025 12,469,718Dense redistribution layers in semiconductor packages and methods of forming the same2025 12,431,400Packages with enlarged through-vias in encapsulant2025 12,381,176Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer2025 12,374,627Method of fabricating semiconductor structure2025 12,362,309Package structure2025 12,315,819Method of forming RDLs and structure formed thereof2025 12,302,677Semiconductor device and method2025 12,176,321Semiconductor packages and method of forming the same2024 12,164,232Method for removing resistor layer, and method of manufacturing semiconductor2024 12,165,985Semiconductor device and method2024 12,148,732Package structure and method of fabrcating the same2024 12,132,023Integrated circuit, package structure, and manufacturing method of package structure2024 12,080,609Method of detecting photoresist scum, method of forming semiconductor package and photoresist scum detection apparatus2024 12,062,603Semiconductor device having via sidewall adhesion with encapsulant2024 12,040,283Method of fabricating semiconductor structure2024 12,021,026Package structure and method of fabricating the same2024 12,020,983Processes for reducing leakage and improving adhesion2024 11,996,381Package structure and method of fabricating the same2024 11,990,383Package structure having at least one die with a plurality of taper-shaped die connectors2024 11,961,811Semiconductor structures and method of manufacturing the same2024 11,855,246Semiconductor device and method2023 11,823,969Packages with enlarged through-vias in encapsulant2023 11,823,936Alignment holder and testing apparatus2023 11,789,366Method for removing resist layer, and method of manufacturing semiconductor2023 11,756,879Semiconductor devices and methods of manufacturing the same2023 11,742,317Process including a re-etching process for forming a semiconductor structure2023 11,670,582Package structure and method of fabricating the same2023 11,664,325Semiconductor structure and method of fabricating the same2023 11,651,994Processes for reducing leakage and improving adhesion2023 11,646,281Semiconductor structures2023 11,600,574Method of forming RDLS and structure formed thereof2023 11,587,902Semiconductor structure and method of forming the same2023 11,557,561Package structure and method of fabricating the same2023 11,527,466Semiconductor device having via sidewall adhesion with encapsulant2022 11,515,224Packages with enlarged through-vias in encapsulant2022 11,515,276Integrated circuit, package structure, and manufacturing method of package structure2022 11,508,633Package structure having taper-shaped conductive pillar and method of forming thereof2022 11,488,908Semiconductor device and method2022 11,450,641Method of fabricating package structure2022 11,417,604Dense redistribution layers in semiconductor packages and methods of forming the same2022 11,404,308Semiconductor package and method2022 11,378,886Method for removing resist layer, and method of manufacturing semiconductor2022 11,335,579Method for manufacturing a semiconductor package and method for testing bonding strength of composite specimen2022 11,251,121Package structure and method of fabricating the same2022 11,244,906Semiconductor structure and method of fabricating the same2022 11,232,971Workpiece holding mechanism, process system and manufacturing method of semiconductor structure2022 11,158,775Semiconductor device and method2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (48)· patent assignee history

2021–2025Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	48	2021–2025

Locations

Location	Patents	Span
TW	48	2021–2025