Inventor
Jun Qian
Inventor
Sherwood, OR, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H01JElectric discharge tubes or discharge lamps13%
H01LSemiconductor devices13%
G01SRadio direction-finding6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
H04LTransmission of digital information, e.g. telegraphic communication6%
H04WWireless communication networks6%
H05HPlasma technique6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
PatentTitleYear
11,133,180Gapfill of variable aspect ratio features with a composite PEALD and PECVD method202111,127,567Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity202111,119,412Exposure equipment and exposure method202111,101,129Ultrathin atomic layer deposition film accuracy thickness control202110,356,560Indication direction-based instruction transmission method and apparatus, smart device and storage medium2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019Patents assigned to ZTE CORP (1)· patent assignee history
2019Based in Shenzhen, CN· patent location history
2021Patents assigned to LAM RES CORP (3)· patent assignee history
2021Patents assigned to SHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD (1)· patent assignee history
2021Based in Sherwood, OR, US· patent location history
2021Based in Shanghai, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 3 | 2021 |
| SHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD | 1 | 2021 |
| ZTE CORP | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Sherwood, OR, US | 3 | 2021 |
| Shanghai, CN | 1 | 2021 |
| Shenzhen, CN | 1 | 2019 |