Inventor
Masayoshi Kohinata
Inventor
Sanda, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
B22FWorking metallic powder11%
C04BLime, magnesia11%
C22CAlloys11%
C25DProcesses for the electrolytic or electrophoretic production of coatings11%
H05KPrinted circuits11%
PatentTitleYear
8,721,961'Au—Sn alloy bump including no large void and method of producing same'20147,556,669'Au-sn alloy powder for solder paste'20095,651,873'Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface'19975,451,279'Method for joining ceramic sintered bodies'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2014Patents assigned to MITSUBISHI MATERIALS CORP (4)· patent assignee history
1995Based in Saitama, JP· patent location history
1997Patents assigned to DAIWA FINE CHEMICALS CO LTD (1)· patent assignee history
1997–2014Based in Sanda, JP· patent location history
2014Patents assigned to KOHINATA MASAYOSHI (1)· patent assignee history
2014Patents assigned to MASAYUKI ISHIKAWA (1)· patent assignee history
2014Patents assigned to MISHIMA AKIFUMI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI MATERIALS CORP | 4 | 1995–2014 |
| DAIWA FINE CHEMICALS CO LTD | 1 | 1997 |
| KOHINATA MASAYOSHIself | 1 | 2014 |
| MASAYUKI ISHIKAWA | 1 | 2014 |
| MISHIMA AKIFUMI | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Sanda, JP | 3 | 1997–2014 |
| Saitama, JP | 1 | 1995 |