LexDanaLexDanabeta
Inventor

Frank Lambrecht

Inventor
Mountain View, CA, US

Overview

72→
Patents
1990–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 72 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G11Cprimary
G11CStatic stores26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
G06FElectric digital data processing14%
H04LTransmission of digital information, e.g. telegraphic communication10%
H01LSemiconductor devices8%
H03LAutomatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses6%
H05KPrinted circuits5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
H10BElectronic memory devices2%
G01RMeasuring electric variables1%
PatentTitleYear
10,699,769Methods and apparatus for synchronizing communication with a memory controller202010,692,842Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows202010,643,977Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows202010,503,201Drift tracking feedback for communication channels201910,391,809Writing instrument201910,192,610Methods and apparatus for synchronizing communication with a memory controller201910,090,280Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows201810,032,752Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows20189,741,423'Methods and apparatus for synchronizing communication with a memory controller'20179,710,011'Drift tracking feedback for communication channels'20179,679,838'Stub minimization for assemblies without wirebonds to package substrate'20179,679,876'Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other'20179,530,458'Stub minimization using duplicate sets of signal terminals'20169,515,053'Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis'20169,496,243'Microelectronic assembly with opposing microelectronic packages each having terminals with signal assignments that mirror each other with respect to a central axis'20169,466,353'Methods and apparatus for synchronizing communication with a memory controller'20169,437,579'Multiple die face-down stacking for two or more die'20169,423,824'Stub minimization for multi-die wirebond assemblies with parallel windows'20169,377,824'Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows'20169,373,565'Stub minimization for assemblies without wirebonds to package substrate'20169,287,195'Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows'20169,281,271'Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate'20169,224,431'Stub minimization using duplicate sets of signal terminals'20159,159,388'Methods and apparatus for synchronizing communication with a memory controller'20159,124,390'Drift tracking feedback for communication channels'20159,013,033'Multiple die face-down stacking for two or more die'20158,981,547'Stub minimization for multi-die wirebond assemblies with parallel windows'20158,766,434'Semiconductor module with micro-buffers'20148,670,261'Stub minimization using duplicate sets of signal terminals'20148,666,007'Methods and apparatus for synchronizing communication with a memory controller'20148,659,143'Stub minimization for wirebond assemblies without windows'20148,659,140'Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate'20148,659,141'Stub minimization using duplicate sets of terminals for wirebond assemblies without windows'20148,659,139'Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate'20148,659,142'Stub minimization for wirebond assemblies without windows'20148,653,646'Stub minimization using duplicate sets of terminals for wirebond assemblies without windows'20148,629,545'Stub minimization for assemblies without wirebonds to package substrate'20148,610,260'Stub minimization for assemblies without wirebonds to package substrate'20138,525,327'Stub minimization for assemblies without wirebonds to package substrate'20138,513,813'Stub minimization using duplicate sets of terminals for wirebond assemblies without windows'20138,504,863'Drift tracking feedback for communication channels'20138,441,111'Stub minimization for multi-die wirebond assemblies with parallel windows'20138,436,477'Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate'20138,436,457'Stub minimization for multi-die wirebond assemblies with parallel windows'20138,405,207'Stub minimization for wirebond assemblies without windows'20138,378,481'Semiconductor module with micro-buffers'20138,374,558'Antenna array with flexible interconnect for a mobile wireless device'20138,345,441'Stub minimization for multi-die wirebond assemblies with parallel windows'20138,278,764'Stub minimization for multi-die wirebond assemblies with orthogonal windows'20128,256,123'Displacement sensing using a flexible substrate'20128,254,155'Stub minimization for multi-die wirebond assemblies with orthogonal windows'20128,213,872'Technique for low-power operation of a wireless device'20128,208,595'Apparatus for data recovery in a synchronous chip-to-chip system'20128,143,720'Semiconductor module with micro-buffers'20127,970,089'Apparatus for data recovery in a synchronous chip-to-chip system'20117,640,448'Drift tracking feedback for communication channels'20097,627,066'Apparatus for data recovery in a synchronous chip-to-chip system'20097,526,664'Drift tracking feedback for communication channels'20097,349,510'Apparatus for data recovery in a synchronous chip-to-chip system'20087,236,894'Circuits, systems and methods for dynamic reference voltage calibration'20077,162,376'Circuits, systems and methods for dynamic reference voltage calibration'20077,159,136'Drift tracking feedback for communication channels'20077,135,970'Method and device for intrusion detection using an optical continuity system'20066,961,862'Drift tracking feedback for communication channels'20056,882,593'Adjustable clock driver circuit'20056,836,503'Apparatus for data recovery in a synchronous chip-to-chip system'20046,775,809'Technique for determining performance characteristics of electronic systems'20046,570,944'Apparatus for data recovery in a synchronous chip-to-chip system'20035,455,579'Digitized stored voice paging receiver'19955,259,021'Transmission of interconnection information for next generation cordless telephone networks'19935,006,861'Antenna'19914,965,569'Digitized stored voice paging receiver'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1990–1995Based in Miramar, FL, US· patent location history
2003–2020Patents assigned to RAMBUS INC (30)· patent assignee history
2003–2020Based in Mountain View, CA, US· patent location history
2012–2020Patents assigned to INVENSAS CORP (34)· patent assignee history
2012–2014Patents assigned to LAMBRECHT FRANK (25)· patent assignee history
2012–2014Patents assigned to CRISP RICHARD DEWITT (17)· patent assignee history
2012–2014Patents assigned to HABA BELGACEM (17)· patent assignee history
2012–2014Based in Mountainview, CA, US· patent location history
2014–2015Based in San Jose, CA, US· patent location history
2016–2020Based in Danville, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INVENSAS CORP342012–2020
RAMBUS INC302003–2020
LAMBRECHT FRANKself252012–2014
CRISP RICHARD DEWITT172012–2014
HABA BELGACEM172012–2014
Locations
LocationPatentsSpan
Mountain View, California, US532003–2020
Mountainview, California, US62012–2014
Danville, California, US52016–2020
San Jose, California, US22014–2015
Miramar, Florida, US21990–1995