Inventor
Tse-Lun Tsai
Inventor
Changhua County, TW
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices22%
G06FElectric digital data processing11%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
11,133,289Semiconductor package and manufacturing method of semiconductor package having plurality of encapsulating materials202111,101,145Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material20217,469,376'System and method for compiling documents and tracking technology changes in a semiconductor manufacturing environment using a document generation engine'20086,819,542'Interdigitated capacitor structure for an integrated circuit'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2008Patents assigned to TAIWAN SEMICONDUCTOR MFG (2)· patent assignee history
2004–2008Based in Taipei, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2021Based in Changhua County, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 2 | 2004–2008 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 2 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Changhua County, TW | 2 | 2021 |
| Taipei, TW | 2 | 2004–2008 |