Inventor
Yung-Sheng Chiu
Inventor
Hsinchu, TW
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation24%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution16%
H01LSemiconductor devices11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
Y02PClimate change mitigation technologies in the production or processing of goods11%
H10DInorganic electric semiconductor devices8%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
C23CCoating metallic material3%
G06FElectric digital data processing3%
H10KOrganic electric solid-state devices3%
PatentTitleYear
10,672,925Thin film solar cell and method of forming same20209,166,094'Method for forming solar cells'20159,130,113'Method and apparatus for resistivity and transmittance optimization in TCO solar cell films'20159,105,799'Apparatus and method for producing solar cells using light treatment'20158,796,063'Superstrate solar cell'20148,530,263'Superstrate solar cell'20138,355,107'Display panel with photo-curable sealant and manufacture method thereof'20138,198,685'Transistors with metal gate and methods for forming the same'20128,138,076'MOSFETs having stacked metal gate electrodes and method'20128,127,167'Methods for reducing power consumption and devices using the same'20127,947,588'Structure and method for a CMOS device with doped conducting metal oxide as the gate electrode'20117,898,634'Display panel with photo-curable sealant and manufacture method thereof'20116,762,554'Electroluminescent device with drying film and method for fabricating the same'20046,627,983'Stacked package structure of image sensor'20036,590,269'Package structure for a photosensitive chip'20036,565,008'Module card and a method for manufacturing the same'20036,559,539'Stacked package structure of image sensor'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003Patents assigned to KINGPAK TECH INC (2)· patent assignee history
2003Based in Hsinchu County, TW· patent location history
2011–2014Patents assigned to TAIWAN SEMICONDUCTOR MFG (5)· patent assignee history
2011–2013Patents assigned to AU OPTRONICS CORP (2)· patent assignee history
2011–2013Based in Hsinchu, TW· patent location history
2012–2013Patents assigned to CHIU YUNG-SHENG (4)· patent assignee history
2012Based in Taipei, TW· patent location history
2013–2015Based in Jhudong Township, TW· patent location history
2015–2020Patents assigned to TSMC SOLAR LTD (3)· patent assignee history
2015–2020Based in Fuxing Shiang, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 5 | 2011–2014 |
| CHIU YUNG-SHENGself | 4 | 2012–2013 |
| TSMC SOLAR LTD | 3 | 2015–2020 |
| AU OPTRONICS CORP | 2 | 2011–2013 |
| KINGPAK TECH INC | 2 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 5 | 2011–2013 |
| Fuxing Shiang, TW | 3 | 2015–2020 |
| Jhudong Township, TW | 3 | 2013–2015 |
| Hsinchu County, TW | 3 | 2003 |
| Taipei, TW | 1 | 2012 |