Inventor
Shwang-Ming Cheng
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10DInorganic electric semiconductor devices17%
PatentTitleYear
7,564,136'Integration scheme for Cu/low-k interconnects'20097,405,481'Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip'20087,314,828'Repairing method for low-k dielectric materials'20087,160,800'Decreasing metal-silicide oxidation during wafer queue time'20077,135,402'Sealing pores of low-k dielectrics using CxHy'20067,115,974'Silicon oxycarbide and silicon carbonitride based materials for MOS devices'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2009Patents assigned to TAIWAN SEMICONDUCTOR MFG (5)· patent assignee history
2006Patents assigned to TAIWAN SEMICONDUCTOR MANFACTUR (1)· patent assignee history
2006–2009Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 5 | 2006–2009 |
| TAIWAN SEMICONDUCTOR MANFACTUR | 1 | 2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 6 | 2006–2009 |