LexDanaLexDanabeta
Inventor

Huifang JIAO

Inventor
CN

Overview

3→
Patents
2023–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
G11CStatic stores14%
H10DInorganic electric semiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
PatentTitleYear
12,593,689Semiconductor structure with diamond heat dissipation and manufacturing method thereof202612,183,425Data reading/writing method, memory, storage apparatus, and terminal202411,756,922Hybrid bonding structure and hybrid bonding method2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2026Patents assigned to HUAWEI TECH CO LTD (3)· patent assignee history
2023–2026Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HUAWEI TECH CO LTD32023–2026
Locations
LocationPatentsSpan
CN32023–2026