Inventor
Nobutaka Mizutani
Inventor
Nirasaki, JP
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H01LSemiconductor devices18%
A63BApparatus for physical training, gymnastics, swimming, climbing, or fencing7%
C25DProcesses for the electrolytic or electrophoretic production of coatings3%
B05DProcesses for applying fluent materials to surfaces, in general1%
B29CShaping or joining of plastics1%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts1%
B29LIndexing scheme associated with subclass b29c, relating to particular articles1%
PatentTitleYear
11,130,030Golf club202111,130,031Golf club202111,123,618Golf club202111,110,327Golf club head202111,110,326Golf club head202110,755,973Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium202010,731,256Plating apparatus, plating method, and recording medium202010,224,208Plating method and recording medium201910,224,202Forming method of hard mask, forming apparatus of hard mask and recording medium201910,179,950Plating method, plated component, and plating system201910,138,556Plating method, plating apparatus, and storage medium201810,030,308Plating method, plating system and storage medium20189,966,306Catalyst layer forming method, catalyst layer forming system and recording medium20189,888,585'Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure'20189,837,308Plating method, plating system and storage medium20179,725,810'Plating method, plating apparatus and storage medium'20179,711,363'Plating method, recording medium and plating system'20179,650,717'Pre-treatment method of plating, storage medium, and plating system'20179,653,354'Metal wiring layer forming method, metal wiring layer forming apparatus, and recording medium'20179,653,350'Pre-treatment method for plating and storage medium'20179,552,994'Plating apparatus, plating method, and storage medium'20178,741,070'Liquid processing method, liquid processing apparatus and recording medium'20147,176,142'Method of manufacturing trench structure for device'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2020Patents assigned to TOKYO ELECTRON LTD (18)· patent assignee history
2007–2019Based in Nirasaki, JP· patent location history
2014–2017Patents assigned to MIZUTANI NOBUTAKA (2)· patent assignee history
2014Patents assigned to FUJITA AKIRA (1)· patent assignee history
2018Patents assigned to A SCHOOL CORPORATION KANSAI UNIV (1)· patent assignee history
2019–2020Based in Tokyo, JP· patent location history
2019Based in Yamanashi, JP· patent location history
2021Patents assigned to SUMITOMO RUBBER IND (5)· patent assignee history
2021Based in Kobe, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 18 | 2007–2020 |
| SUMITOMO RUBBER IND | 5 | 2021 |
| MIZUTANI NOBUTAKAself | 2 | 2014–2017 |
| A SCHOOL CORPORATION KANSAI UNIV | 1 | 2018 |
| FUJITA AKIRA | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nirasaki, JP | 14 | 2007–2019 |
| Kobe, JP | 5 | 2021 |
| Tokyo, JP | 3 | 2019–2020 |
| Yamanashi, JP | 1 | 2019 |