Inventor
Muneo Miura
Inventor
Kyoto, JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
C25DProcesses for the electrolytic or electrophoretic production of coatings25%
H01LSemiconductor devices25%
H05KPrinted circuits13%
PatentTitleYear
9,728,426'Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member'20179,580,827'Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member'20177,439,101'Resin encapsulation molding method for semiconductor device'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2017Patents assigned to TOWA CORP (3)· patent assignee history
2008Based in Singapore, SG· patent location history
2017Based in Kyoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOWA CORP | 3 | 2008–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyoto, JP | 2 | 2017 |
| Singapore, SG | 1 | 2008 |