Inventor
Timothy B. Dean
Inventor
Elk Grove Village, IL, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
Y10TTechnical subjects covered by former us classification20%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
C23CCoating metallic material7%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure7%
H01RElectrically-conductive connections7%
PatentTitleYear
7,434,310'Process to reform a plastic packaged integrated circuit die'20087,390,978'Overmolded electronic assembly and overmoldable interface component'20087,241,510'Peelable circuit board foil'20077,193,838'Printed circuit dielectric foil and embedded capacitors'20077,078,796'Corrosion-resistant copper bond pad and integrated device'20066,974,776'Activation plate for electroless and immersion plating of integrated circuits'20056,872,468'Peelable circuit board foil'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2008Patents assigned to MOTOROLA INC (5)· patent assignee history
2005–2006Patents assigned to FREESCALE SEMICONDUCTOR INC (2)· patent assignee history
2005–2008Based in Elk Grove Village, IL, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MOTOROLA INC | 5 | 2005–2008 |
| FREESCALE SEMICONDUCTOR INC | 2 | 2005–2006 |
Locations
| Location | Patents | Span |
|---|---|---|
| Elk Grove Village, Illinois, US | 7 | 2005–2008 |