Inventor

Hee Seok Jung

Inventor

Hwaseong-si, KR

Overview

28→

Patents

2014–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 28 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits37%

H01RElectrically-conductive connections15%

G06FElectric digital data processing7%

LOC137%

A61BDiagnosis4%

G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%

G06KGraphical data reading4%

G06VImage or video recognition or understanding4%

H04MTelephonic communication4%

G01RMeasuring electric variables2%

PatentTitleYear

10,804,635Board mating connector in which signal contact unit and ground contact unit are interlocked2020 10,790,604Board-mating connector with reduced coupling height2020 10,750,612Flexible circuit board having enhanced bending durability and method for preparing same2020 10,700,456Board-mating connector with reduced coupling height2020 10,681,803Flexible circuit board with improved bonding flatness2020 10,681,823Mounting structure for module in electronic device2020 D0886073Flexible printed circuit board2020 10,624,209Flexible printed circuit board2020 10,622,765Board mating connector2020 10,566,710Coaxial cable connector2020 10,561,015Flexible circuit board having enhanced bending durability and method for preparing same2020 10,530,099Board mating connector including ground unit in which tapered portion is formed2020 10,512,158Flexible circuit board with improved bonding position accuracy2019 10,477,690Flexible circuit board2019 10,448,499Flexible printed circuit board with narrower line width2019 10,440,816Flexible circuit board with improved bonding position accuracy2019 10,440,815Flexible circuit board with improved bonding position accuracy2019 10,365,687Laptop computer2019 10,362,675Flexible circuit board having three-layer dielectric body and four-layer ground layer structure2019 10,356,895Flexible circuit board having enhanced bending durability and method for preparing same2019 10,306,773Mounting structure for module in electronic device2019 10,299,375Flexible circuit board having enhanced bending durability2019 D0848370Radio frequency connector2019 10,276,949Connector and blind mating connector including the same2019 9,532,446'Printed circuit board including linking extended contact pad'2016 9,459,286'Large-area probe card and method of manufacturing the same'2016 9,397,390'Terminal having HF transmission line using printed circuit board'2016 D0715742'Pogo pin'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2020Patents assigned to GIGALANE CO LTD (26)· patent assignee history

2014–2020Based in Gyeonggi-do, KR· patent location history

2016–2020Based in Hwaseong-si, KR· patent location history

2019–2020Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
GIGALANE CO LTD	26	2014–2020
SAMSUNG ELECTRONICS CO LTD	2	2019–2020

Locations

Location	Patents	Span
Hwaseong-si, KR	23	2016–2020
Gyeonggi-do, KR	5	2014–2020