Inventor

Tzyy-Jang Tseng

Inventor

Hsinchu, TW

Overview

2000–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 71 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits26%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%

Y10TTechnical subjects covered by former us classification16%

H01LSemiconductor devices15%

C25DProcesses for the electrolytic or electrophoretic production of coatings3%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%

C23CCoating metallic material2%

H10HInorganic light-emitting semiconductor devices having potential barriers2%

F21VFunctional features or details of lighting devices or systems thereof1%

F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted1%

PatentTitleYear

11,127,664Circuit board and manufacturing method thereof2021 11,114,782Method of manufacturing circuit board structure2021 10,957,658Package structure with structure reinforcing element and manufacturing method thereof2021 10,925,172Carrier structure and manufacturing method thereof2021 10,897,823Circuit board, package structure and method of manufacturing the same2021 10,863,618Composite substrate structure and manufacturing method thereof2020 10,854,803Manufacturing method of light emitting device package structure with circuit redistribution structure2020 10,756,050Package structure and bonding method thereof2020 10,685,922Package structure with structure reinforcing element and manufacturing method thereof2020 10,658,282Package substrate structure and bonding method thereof2020 10,651,358Light emitting device package structure with circuit redistribution structure and manufacturing method thereof2020 10,588,214Stacked structure and method for manufacturing the same2020 10,271,433Method of fabricating an electrical device package structure2019 10,211,139Chip package structure2019 10,076,039Method of fabricating packaging substrate2018 9,933,149Illumination apparatus2018 9,913,418'Process of an embedded component structure'2018 9,859,130'Manufacturing method of interposed substrate'2018 9,831,103Manufacturing method of interposed substrate2017 9,781,843'Method of fabricating packaging substrate having embedded through-via interposer'2017 9,510,464'Manufacturing method of circuit board'2016 9,484,223'Coreless packaging substrate and method of fabricating the same'2016 9,485,863'Carrier and method for fabricating coreless packaging substrate'2016 9,460,992'Packaging substrate having a through-holed interposer'2016 9,370,107'Embedded component structure and process thereof'2016 9,357,659'Packaging substrate having embedded through-via interposer'2016 9,337,136'Method of fabricating a through-holed interposer'2016 9,282,646'Interposed substrate and manufacturing method thereof'2016 9,257,379'Coreless packaging substrate and method of fabricating the same'2016 9,224,683'Method of fabricating packaging substrate having a through-holed interposer'2015 9,161,454'Electrical device package structure and method of fabricating the same'2015 9,111,948'Method of fabricating semiconductor package structure'2015 9,070,616'Method of fabricating packaging substrate'2015 D0729961'Lighting bulb'2015 8,981,570'Through-holed interposer, packaging substrate, and methods of fabricating the same'2015 8,956,909'Method of fabricating an electronic device comprising photodiode'2015 8,952,268'Interposed substrate and manufacturing method thereof'2015 8,946,564'Packaging substrate having embedded through-via interposer and method of fabricating the same'2015 8,912,642'Packaging substrate and fabrication method thereof'2014 8,859,912'Coreless package substrate and fabrication method thereof'2014 8,835,992'Electronic device comprising electrical contact pads'2014 8,709,865'Fabrication method of packaging substrate having through-holed interposer embedded therein'2014 8,633,061'Method of fabricating package structure'2014 8,624,382'Packaging substrate and method of fabricating the same'2014 8,624,366'Semiconductor package structure and method of fabricating the same'2014 8,598,463'Circuit board and manufacturing method thereof'2013 8,578,600'Process for manufacturing a circuit board'2013 8,563,363'Fabricating method of semiconductor package structure'2013 8,513,796'Package structure, fabricating method thereof, and package-on-package device thereby'2013 8,450,623'Circuit board'2013 8,424,202'Process for fabricating a circuit board'2013 8,390,013'Semiconductor package structure and fabricating method of semiconductor package structure'2013 8,365,401'Circuit board and manufacturing method thereof'2013 8,294,034'Circuit board and process for fabricating the same'2012 8,288,662'Circuit structure'2012 8,269,337'Packaging substrate having through-holed interposer embedded therein and fabrication method thereof'2012 8,247,705'Circuit substrate and manufacturing method thereof'2012 8,161,638'Manufacturing method of circuit structure'2012 8,051,560'Method of fabricating a solder pad structure'2011 7,906,200'Composite circuit substrate structure'2011 7,867,908'Method of fabricating substrate'2011 7,834,274'Multi-layer printed circuit board and method for fabricating the same'2010 7,642,571'Substrate core'2010 7,535,098'Structure of substrate'2009 7,520,755'Method of forming solder mask and wiring board with solder mask'2009 7,393,720'Method for fabricating electrical interconnect structure'2008 7,080,924'LED light source with reflecting side wall'2006 6,201,300'Printed circuit board with thermal conductive structure'2001 6,175,497'Thermal vias-provided cavity-down IC package structure'2001 6,057,601'Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate'2000 6,032,355'Method of forming thermal conductive structure on printed circuit board'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2021Based in Hsinchu, TW· patent location history

2008–2021Patents assigned to UNIMICRON TECHNOLOGY CORP (62)· patent assignee history

2010–2021Based in Taoyuan, TW· patent location history

2012–2016Patents assigned to TSENG TZYY-JANG (24)· patent assignee history

2012–2015Patents assigned to HU DYI-CHUNG (7)· patent assignee history

2012–2016Patents assigned to CHEN TSUNG-YUAN (6)· patent assignee history

2012–2016Patents assigned to CHIANG SHU-SHENG (6)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
UNIMICRON TECHNOLOGY CORP	62	2008–2021
TSENG TZYY-JANGself	24	2012–2016
HU DYI-CHUNG	7	2012–2015
CHEN TSUNG-YUAN	6	2012–2016
CHIANG SHU-SHENG	6	2012–2016

Locations

Location	Patents	Span
Hsinchu, TW	39	2000–2021
Taoyuan, TW	32	2010–2021