Inventor

Toshiki Okazaki

Inventor

Wakaya, JP

Overview

2→

Patents

1988–2004

Patent span

Performing operations

Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary

B29CShaping or joining of plastics17%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts17%

B29LIndexing scheme associated with subclass b29c, relating to particular articles17%

B41MPrinting, duplicating, marking, or copying processes17%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests17%

Y10TTechnical subjects covered by former us classification17%

PatentTitleYear

6,732,488'Sealing device for packaging material and measuring method for fusion temperature of plastics'2004 4,746,646'Printing paper for thermal transfer printing'1988

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1988Patents assigned to HONSHU PAPER CO LTD (1)· patent assignee history

1988Patents assigned to SONY CORP (1)· patent assignee history

1988Based in Tokyo, JP· patent location history

2004Patents assigned to KAO CORP (1)· patent assignee history

2004Based in Wakaya, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HONSHU PAPER CO LTD	1	1988
KAO CORP	1	2004
SONY CORP	1	1988

Locations

Location	Patents	Span
Wakaya, JP	1	2004
Tokyo, JP	1	1988