Inventor
Kaname Ozawa
Inventor
Kawasaki, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1067%
G06FElectric digital data processing11%
H05KPrinted circuits11%
H10DInorganic electric semiconductor devices11%
PatentTitleYear
8,097,954'Adhesive layer forming a capacitor dielectric between semiconductor chips'20127,251,801'Method of designing circuit board'20077,138,723'Deformable semiconductor device'20066,777,799'Stacked semiconductor device and method of producing the same'20046,621,169'Stacked semiconductor device and method of producing the same'20036,316,838'Semiconductor device'20016,215,182'Semiconductor device and method for producing the same'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2007Patents assigned to FUJITSU LTD (6)· patent assignee history
2001–2012Based in Kawasaki, JP· patent location history
2012Patents assigned to FUJITSU SEMICONDUCTOR LTD (1)· patent assignee history
2012Patents assigned to OZAWA KANAME (1)· patent assignee history
2012Patents assigned to SATO MITSUTAKA (1)· patent assignee history
2012Patents assigned to YONEDA YOSHIYUKI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 6 | 2001–2007 |
| FUJITSU SEMICONDUCTOR LTD | 1 | 2012 |
| OZAWA KANAMEself | 1 | 2012 |
| SATO MITSUTAKA | 1 | 2012 |
| YONEDA YOSHIYUKI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 7 | 2001–2012 |