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Inventor

Syuichi Osaka

Inventor
Hyogo, JP

Overview

2→
Patents
1989–1990
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1050%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
4,916,397'Semiconductor device with bonding pad'19904,878,610'Die bonding apparatus'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–1990Patents assigned to MITSUBISHI ELECTRIC CORP (2)· patent assignee history
1989Based in Itami, JP· patent location history
1990Based in Hyogo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI ELECTRIC CORP21989–1990
Locations
LocationPatentsSpan
Hyogo, JP11990
Itami, JP11989