Inventor
MASATO KAJINAMI
Inventor
JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
G01NInvestigating or analysing materials by determining their chemical or physical properties11%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors6%
G01BMeasuring length, thickness or similar linear dimensions6%
G02BOptical elements, systems or apparatus6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
G06TImage data processing or generation, in general6%
H04NPictorial communication, e.g. television6%
H05KPrinted circuits6%
PatentTitleYear
12,557,583Chip peeling apparatus and chip peeling method202612,535,315Optical device and optical measurement method202612,500,107Mounting device and mounting method202512,444,625Chip peeling apparatus and chip peeling method using the same202512,051,604Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device202411,314,073Lighting device and inspection apparatus having the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (6)· patent assignee history
2022–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 6 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 6 | 2022–2026 |