Inventor

Mei-Fang Wang

Inventor

Hisnchu, TW

Overview

6→

Patents

2003–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices21%

H10DInorganic electric semiconductor devices21%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%

LOC1414%

B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers7%

PatentTitleYear

11,127,684Low-resistance interconnect structures2021 11,107,896Vertical interconnect features and methods of forming2021 11,062,945Methods for reducing contact depth variation in semiconductor fabrication2021 6,942,099'Cushion package structure'2005 D0484872'Wireless adapter'2004 D0471183'Cable modem'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2005Patents assigned to ACCTON TECHNOLOGY CORP (3)· patent assignee history

2003Based in Hsinchu County, TW· patent location history

2004Based in Fonghua Village, TW· patent location history

2005Based in Hisnchu, TW· patent location history

2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ACCTON TECHNOLOGY CORP	3	2003–2005
TAIWAN SEMICONDUCTOR MFG CO LTD	3	2021

Locations

Location	Patents	Span
Hisnchu, TW	1	2005
Fonghua Village, TW	1	2004
Hsinchu County, TW	1	2003