Inventor
Hong T. Lim
Inventor
San Jose, CA, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1083%
H05KPrinted circuits17%
PatentTitleYear
7,420,809'Heat spreader in integrated circuit package'20087,235,889'Integrated heatspreader for use in wire bonded ball grid array semiconductor packages'20076,897,555'Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die'20056,687,133'Ground plane on 2 layer PBGA'20046,555,914'Integrated circuit package via'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2005Patents assigned to LSI LOGIC CORP (3)· patent assignee history
2003–2008Based in San Jose, CA, US· patent location history
2007–2008Patents assigned to LSI CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LSI LOGIC CORP | 3 | 2003–2005 |
| LSI CORP | 2 | 2007–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 5 | 2003–2008 |