Inventor
Motoki ETO
Inventor
JP
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H01LSemiconductor devices19%
C22CAlloys17%
B23KSoldering or unsoldering11%
C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys8%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
C21DModifying the physical structure of ferrous metals5%
H01BCables3%
B21CManufacture of metal sheets, wire, rods, tubes, profiles or like semi-manufactured products otherwise than by rolling2%
PatentTitleYear
12,581,982Bonding wire for semiconductor devices202612,532,767Al bonding wire202612,463,172AG alloy bonding wire for semiconductor devices and semiconductor device202512,388,044Al bonding wire202512,325,901AI wiring material202512,300,658Copper alloy bonding wire for semiconductor devices202512,290,883Bonding wire202512,166,006Bonding wire for semiconductor devices202412,132,025Bonding wire202412,090,578Al bonding wire202411,929,343Bonding wire for semiconductor devices202411,721,660Bonding wire for semiconductor devices202311,612,966Ag alloy bonding wire for semiconductor device202311,373,934Bonding wire for semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to NIPPON MICROMETAL CORP (14)· patent assignee history
2022–2026Patents assigned to NIPPON STEEL CHEMICAL & MAT CO LTD (11)· patent assignee history
2022–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NIPPON MICROMETAL CORP | 14 | 2022–2026 |
| NIPPON STEEL CHEMICAL & MAT CO LTD | 11 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 14 | 2022–2026 |