Inventor
John VanNortwick
Inventor
Kuna, ID, US
Overview
Patents· 36 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification22%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
G01RMeasuring electric variables15%
H05KPrinted circuits11%
B41CProcesses for the manufacture or reproduction of printing surfaces7%
B41NPrinting plates or foils7%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
9,048,272'Devices and method for handling microelectronics assemblies'20157,476,277'Apparatus for improving stencil/screen print quality'20097,105,366'Method for in-line testing of flip-chip semiconductor assemblies'20067,074,648'Method for packaging flip-chip semiconductor assemblies'20067,005,878'Method for in-line testing of flip-chip semiconductor assemblies'20066,982,177'Method for in-line testing of flip-chip semiconductor assemblies'20066,972,200'Method for manufacturing flip-chip semiconductor assembly'20056,967,113'Method for in-line testing of flip-chip semiconductor assemblies'20056,962,826'Method for in-line testing of flip-chip semiconductor assemblies'20056,953,699'Method for in-line testing of flip-chip semiconductor assemblies'20056,954,081'Method for in-line testing of flip-chip semiconductor assemblies'20056,953,700'Method for in-line testing of flip-chip semiconductor assemblies'20056,949,943'Method for in-line testing of flip-chip semiconductor assemblies'20056,793,749'Automated method of attaching flip-chip devices to a substrate'20046,773,523'Automated method of attaching flip chip devices to a substrate'20046,750,070'Process for manufacturing flip-chip semiconductor assembly'20046,744,134'Use of a reference fiducial on a semiconductor package to monitor and control a singulation method'20046,669,781'Method and apparatus for improving stencil/screen print quality'20036,641,669'Method and apparatus for improving stencil/screen print quality'20036,638,831'Use of a reference fiducial on a semiconductor package to monitor and control a singulation method'20036,626,222'System for fabricating semiconductor components'20036,607,599'Apparatus for improving stencil/screen print quality'20036,599,365'Apparatus for improving stencil/screen print quality'20036,545,498'Method for in-line testing of flip-chip semiconductor assemblies'20036,537,400'Automated method of attaching flip chip devices to a substrate'20036,521,287'Method for manufacturing improved stencil/screen'20036,472,901'Method for in-line testing of flip-chip semiconductor assemblies'20026,440,777'Method of depositing a thermoplastic polymer in semiconductor fabrication'20026,368,897'Method for manufactoring and using stencil/screen'20026,369,602'Method for in-line testing of flip-chip semiconductor assemblies'20026,329,832'Method for in-line testing of flip-chip semiconductor assemblies'20016,281,044'Method and system for fabricating semiconductor components'20016,238,223'Method of depositing a thermoplastic polymer in semiconductor fabrication'20016,084,311'Method and apparatus for reducing resin bleed during the formation of a semiconductor device'20006,025,212'Method for attaching semiconductor dice to lead-on-chip leadframes'20006,012,502'Apparatus for attaching adhesive tape to lead-on-chip leadframes'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2009Patents assigned to MICRON TECHNOLOGY INC (35)· patent assignee history
2000–2015Based in Kuna, ID, US· patent location history
2000–2003Based in Boise, ID, US· patent location history
2005Based in Kuns, ID, US· patent location history
2015Patents assigned to CASEY CHRISTOPHER E (1)· patent assignee history
2015Patents assigned to FORBIS MICHAEL R (1)· patent assignee history
2015Patents assigned to FORSYTH VALORIS L (1)· patent assignee history
2015Patents assigned to ILLINOIS TOOL WORKS (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 35 | 2000–2009 |
| CASEY CHRISTOPHER E | 1 | 2015 |
| FORBIS MICHAEL R | 1 | 2015 |
| FORSYTH VALORIS L | 1 | 2015 |
| ILLINOIS TOOL WORKS | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kuna, ID, US | 31 | 2000–2015 |
| Boise, ID, US | 4 | 2000–2003 |
| Kuns, ID, US | 1 | 2005 |