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Inventor

Sung-Cheng Chiu

Inventor
Hsinchu, TW

Overview

3→
Patents
2004–2008
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1067%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices33%
PatentTitleYear
7,456,090'Method to reduce UBM undercut'20087,364,998'Method for forming high reliability bump structure'20086,811,955'Method for photoresist development with improved CD'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2008Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history
2004Based in Jubei, TW· patent location history
2008Based in Hsinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG32004–2008
Locations
LocationPatentsSpan
Hsinchu, TW22008
Jubei, TW12004